发明名称 |
PROCESS FOR THICK FILM CIRCUIT PATTERNING |
摘要 |
A process for patterning thick film electrically functional patterns using a photosensitive polymer layer. A tacky photosensitive layer is applied onto a substrate surface. The photosensitive layer is imaged with a pattern using actinic radiation, the exposed areas of the photosensitive layer become hardened and non-tacky. A subsequent application of a thick film composition sheet will cause the thick film to adhere to the remaining tacky areas. Upon peeling the sheet, a thick film print pattern will be produced. This step is followed by a processing profile prescribed by the thick film composition used which results in a pattern having electrically functional properties. The invention also extends to a process wherein a thick film composition is recovered from a used sheet.
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申请公布号 |
US2010104829(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
US20090647700 |
申请日期 |
2009.12.28 |
申请人 |
E.I.DU PONT DE NEMOURS AND COMPANY |
发明人 |
KEUSSEYAN ROUPEN LEON |
分类号 |
B32B3/10;B32B9/04;G03F7/004;G03F7/34;H05K1/09;H05K3/04;H05K3/20 |
主分类号 |
B32B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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