发明名称 ASSEMBLY OF A GROOVED MICROELECTRONIC CHIP WITH A TOROIDAL WIRE ELEMENT AND METHOD OF ASSEMBLING IT
摘要 The invention relates to an assembly of at least one microelectronic chip with a wire element (5), the chip having a groove (4) in which the wire element is embedded. The wire element (5) is a torus of longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires (5a, 5b, 5c) coated with an insulator. The chip includes at least one electrically conducting stud (9) in the groove (4), this stud being in electrical contact with a stripped region of only one of the electrically conducting wires of the torus.
申请公布号 WO2010046563(A1) 申请公布日期 2010.04.29
申请号 WO2009FR01231 申请日期 2009.10.21
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE;BRUN, JEAN;VERRUN, SOPHIE;VICARD, DOMINIQUE 发明人 BRUN, JEAN;VERRUN, SOPHIE;VICARD, DOMINIQUE
分类号 H01L25/065;H01L21/60;H01L21/98;H01L23/48 主分类号 H01L25/065
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