| 摘要 |
<p>Downsizing, cost reduction, and reduced inductance of an input/output circuit are to be achieved with a power converter in which a multilayer substrate having a power semiconductor module (500) and busbars (11, 12) is modularized. The positive busbar (11) and the negative busbar (12) for feeding main circuit current are provided on a surface of a multilayer substrate (100) on which a control unit (10a) is mounted. The positive busbar (11) and the negative busbar (12) are formed to be thicker than the metal wiring in each layer of the multilayer substrate (100). The positive busbar (11) is electrically connected to the 2nth layer wiring (n represents a positive integer) from the positive surface wiring of the multilayer substrate (100), and the negative busbar (12) to the 2n+1th layer wiring opposite the 2nth layer wiring of the multilayer substrate (100), through via holes. As a result, current flows into the power semiconductor module (500) in opposite directions through the 2nth layer wiring and the 2n+1th layer wiring. Thus the inductance of the main circuit is reduced, and downsizing and cost reduction of the high-output power converter energized by a large current can be achieved.</p> |
