摘要 |
A method of manufacturing a microphone having a laminated casing structure, wherein an adverse effect to functions of the microphone due to pressing of substrates when the substrates are bonded and affixed together is effectively minimized with high bonding strength between the substrates achieved. In manufacturing a microphone by dividing a microphone assemblage (110) into microphones, a top substrate assemblage (124) and a bottom substrate assemblage (126) are respectively made to be in contact with both the upper and lower surfaces of a body substrate assemblage (122) with bonding sheet assemblages (154, 156) respectively arranged on first and second bonding regions (124a, 126a) of the top and bottom substrate assemblages (124, 126). In this state, the substrate assemblages are pressed together by first and second pressing plates (164, 166) from both the upper and lower side of the substrate assemblages (124, 126), and by this, the substrate assemblages (124, 126) are bonded and affixed. In the above process, projections (164a) are previously formed on the first pressing plate (164) at those portions of the lower surface thereof which face the first bonding regions (124a), and the projections (164a) are positioned so that, when the substrate assemblages are pressed together as described above, the projections (164a) make contact with the top substrate assemblage (124) at those portions of the upper surface thereof at which top substrates (24) of the top substrate assemblage (124) are connected together.
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申请人 |
STAR MICRONICS CO., LTD.;YONEHARA, KENTARO;ITO, MOTOAKI;SAWAMOTO, NORIHIRO;TSUKUDA, YASUNORI |
发明人 |
YONEHARA, KENTARO;ITO, MOTOAKI;SAWAMOTO, NORIHIRO;TSUKUDA, YASUNORI |