| 摘要 |
A thermoelectric conversion device with reduced thermal stress between a thermoelectric conversion element and a substrate is disclosed. Solders are between a first conductor and first end faces of a plurality of thermoelectric conversion elements and between a second conductor and second end faces of the thermoelectric conversion elements. At least one of the first conductor and the second conductor comprises at least one protrusion which protrudes toward one of the thermoelectric conversion elements. The at least one protrusion is in an area of at least one of the first end faces and second end faces, and coated by the solder. |
