| 摘要 |
PURPOSE: A multichip LED package is provided to simplify a manufacturing process using an inclined via-hole side of a printed circuit board, which is metal plated, as a reflective plate. CONSTITUTION: A plurality of LED chips(20) are attached on the upper side of a metal base(10) for radiating heat. The LED chips include via holes of a funnel shape. A circuit wiring(32) is formed on a printed circuit board(30) in order to connect the LED chips. A first wire and a second wire connect the LED chips and the circuit wiring. A sealing material fills the via-holes. |
