发明名称 |
METHOD AND APPARATUS FOR DETERMINING SHEAR FORCE BETWEEN THE WAFER HEAD AND POLISHING PAD IN CHEMICAL MECHANICAL POLISHING |
摘要 |
PURPOSE: A method and an apparatus for determining shear force between a wafer head and a polishing pad in a chemical mechanical polishing(CMP) process are provided to improve the precision of the shear force by including a plate which slides between the center of the polishing pad and the wafer head. CONSTITUTION: A CMP tool(10) is located on a wafer head(12). The CMP tool includes a rotary unit(14), a diamond conditioner disc(16) and a polishing pad(20). The wafer head and a support unit are placed on a plate. The plate is connected to the framework of the CMP tool by a low friction movement unit. The low friction movement unit slides to a vertical direction to the center of the polishing pad and the wafer head. A load cell sensor is fixed to the framework of the CMP tool. Shear force is determined according to signal from the load cell sensor.
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申请公布号 |
KR20100044061(A) |
申请公布日期 |
2010.04.29 |
申请号 |
KR20080115436 |
申请日期 |
2008.11.19 |
申请人 |
ARACA INCORPORATED;FUJIKOSHI MACHINERY CORPORATION |
发明人 |
BORUCKI LEONARD;SUDARGHO FRANSISCA MARIA ASTRID;PHILIPOSSIAN ARA;FURUKAWA MASANORI;ICHIKAWA KOICHIRO |
分类号 |
H01L21/304;B24B37/04 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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