| 摘要 |
PURPOSE: A heat radiant FPCB and a manufacturing method thereof are provided to efficiently discharge heat from an LED by forming an inorganic coating layer and a heat sink on the lower side of the FPCB. CONSTITUTION: An FCCL(Flexible Copper Clad Laminate) layer(130) is formed by laminating a copper foil on both sides of a polyimide film. A copper plate layer(120) is formed on both sides of the FCCL layer. A heat sink substrate(230) is attached to one side of the copper plate layer and includes a heat sink(210), an inorganic coating layer(220), and a thermal conductive tape(200). The inorganic coating layer is formed on one side of the heat sink. The thermal conductive tape is attached to the other side of the heat sink.
|
