| 摘要 |
<p>A method of fabricating a wafer-level package is described. The method includes providing an active device on a semiconductor wafer (300) that has not been singulated, the active device having a plurality of bonding pads (104) exposed at an upper surface of the wafer (300). Prior to singulating the semiconductor wafer (300), a plurality of stud bumps (106,610) are formed with a wire bonding tool on the plurality of bonding pads (104,612). Thereafter, a moulding encapsulation layer (108) is applied over the semiconductor wafer (300), leaving an upper portion of each of the plurality of stud bumps (106) exposed.</p> |
