发明名称 Hot melt pressure sensitive adhesives for paper lables
摘要 A HMPSA is provided that preferably includes at least a) from 30 to 50% of a mixture of triblock and diblock styrenic copolymers having an overall styrene content comprised between 14 and 40%, b) from 40 to 55% of a tackifying resin with a softening temperature comprised between 70 and 150° C. obtainable by hydrogenating, polymerizing or copolymerizing mixtures of aliphatic unsaturated hydrocarbons having about 5, 9 or 10 carbon atoms; c) from 4 to 20% of a hydrocarbon oil with an aromatic content less than 15%; d) from 1 to 6% of a filler selected among calcium carbonate or a low molecular weight homopolymer or copolymer of polyethylene. A laminated system is also provided that includes at least an adhesive layer utilizing the HMPSA and paper facestock. Also included are PSA labels obtainable from the laminated system with a reduced tendency to discolor after storage.
申请公布号 ZA200902672(B) 申请公布日期 2010.04.28
申请号 ZA20090002672 申请日期 2009.04.17
申请人 BOSTIK S.A. 发明人 GOUBARD, DAVID;HAEGER, ROBERT JOHN
分类号 C08L;C09J 主分类号 C08L
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