发明名称 Device housing and method for manufacturing the same
摘要 <p>A device housing and a method of fabricating the device housing are provided. The device housing includes a base housing, a bottom coating, a pattern layer, a middle coating and a top coating. The bottom coating is directly formed on the base housing. The pattern layer is a vacuum evaporation coating and directly formed on the bottom coating. The middle coating is of a degree of transparency and directly formed on the pattern layer. The transparent top coating is directly formed on the middle coating.</p>
申请公布号 EP2179798(A1) 申请公布日期 2010.04.28
申请号 EP20090173649 申请日期 2009.10.21
申请人 FIH (HONG KONG) LIMITED 发明人 CHIANG, CHWAN-HWA;CHEN, JENG-SHIUNG
分类号 B05D5/06;B05D7/04 主分类号 B05D5/06
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