| 摘要 |
Disclosed is a photosensitive composition containing a polysiloxane (a), an acrylic resin (b), a quinonediazide compound (c) and a solvent (d). In this photosensitive composition, the mixing ratio between the polysiloxane (a) and the acrylic resin (b), namely polysiloxane/acrylic resin is from 80/20 to 20/80 in weight ratio, and the polysiloxane (a) is synthesized by reacting one or more organosilanes represented by the following general formula (1). (In the formula, Rrepresents a hydrogen, an alkyl group having 1-10 carbon atoms, an alkenyl group having 2-10 carbon atoms or an aryl group having 6-15 carbon atoms, and a plurality of R's may be the same as or different from each other; Rrepresents a hydrogen, an alkyl group having 1-6 carbon atoms, an acyl group having 2-6 carbon atoms, or an aryl group having 6-15 carbon atoms, and a plurality of R's may be the same as or different from each other; and n represents an integer of 0-3.) The photosensitive composition enables to obtain a cured film which has high heat resistance and high transparency, while exhibiting good adhesion to a substrate. This photosensitive composition is used for forming a planarization film for TFT substrates, an interlayer insulating film, or a core or cladding material for optical waveguides. |
