| 摘要 |
<p>1,018,876. Semi-conductor devices. TEXAS INSTRUMENTS Inc. Dec. 31, 1962 [May 22, 1962], No. 49032/62. Heading H1K. A header for a semi-conductor device comprises a metallic member having a flat surface on which the device is mounted, the flat surface being stabilized in relation to a major surface of a disc-shaped body of insulating material by being set in a recess in the surface. In one embodiment, the flat mounting surface is made by bending a wire 18, Fig. 1 (not shown), back on itself, as at 11 and 24 and flattening the radially projecting limb 20. The downwardly projecting limb is passed through an aperture 10 in a disc-shaped glass block 8 and other leads, as 16, as may be required, are passed through similar holes 12. A recess 14 is provided in the upper surface of the block 8 to position the flattened portion 20. A metal collar 2 is then placed around the block and the assembly is heated to fuse the glass and cause it to adhere to the lead wires and seal -on to the collar 2. To complete the device, the semi-conductor device is mounted on the flat surface 20, and other leads are taken to the wires 16, and finally an enclosing can is placed over the device and sealed to the collar 2. It is alternatively proposed that the flat mounting surface should be formed either by merely bending the lead wire to a right-angle and flattening the laterally projecting end portion or, for a heavier form of construction, by soldering or welding a flat plate to a straight lead wire.</p> |
