| 摘要 |
<p>Disclosed is an insulating sheet that has excellent handleability in an uncured state, can suppress excessive flow during lamination pressing, and further can provide a cured product having excellent dielectric breakdown properties, thermal conductivity, heat resistance, and processability. The insulating sheet is used for bonding a thermal conductor having a thermal conductivity of not less than 10 W/m·K to an electroconductive layer. The insulating sheet comprises a polymer (A) having a weight average molecule weight of not less than 10,000, at least one monomer of an epoxy monomer (B1) having an aromatic skeleton and having a weight average molecule weight of not more than 600 and an oxetane monomer (B2), a curing agent (C), 20 to 60% by volume of a first inorganic filler (D), and 1 to 40% by volume of at least one filler (E) of an organic filler (E1) and a second inorganic filler (E2) different from the first inorganic filler (D) and having a new Mohs hardness of 3 or less. In the case when the organic filler (E1) is contained, the content of the organic filler (E1) is 3 to 40% by volume.</p> |
