POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

摘要

PURPOSE: A positive photosensitive resin composition is provided to reduce the molecular weight of a polymer before hardening by efficiently forming a cross linkage during thermal curing, and to improve mechanical property. CONSTITUTION: A positive photosensitive resin composition contains: a polybenzoxazole precursor including a recurring unit marked as the chemical formula 1 and a thermal polymerization functional group induced from monocarboxylic acid halide; a photosensitivity diazoquinone compound; and a silane compound, a phenolic compound, and a solvent. In the chemical formula 1, X1 is a tetravalent aromatic group or an aliphatic organic group. Y1 and Y2 is the aromatic group or the aliphatic organic group compounds from divalence to hexavalent, respectively. The m and n is a molar ratio.