| 摘要 |
A method of a seamless model free of bond lines. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modelling paste to a structure support in the form of a continuous layer, curing the applied modelling paste, and machining the cured layer of modelling paste to the desired contour. The modelling paste a low density curable composition prepared from thixotropic epoxy or polyurethane containing microballoons.
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