发明名称 |
Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit |
摘要 |
An integrated circuit having an integrated circuit die and at least one height-sensing pad disposed on a top surface of the integrated circuit die and electrically isolated from the die circuitry. At least one bond pad is disposed on a top surface of the integrated circuit die and electrically connected to the die circuitry. The at least one bond pad is configured for wire-bonding to a lead of a leadframe utilizing a height coordinate of the at least one height-sensing pad.
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申请公布号 |
US7705473(B2) |
申请公布日期 |
2010.04.27 |
申请号 |
US20060385086 |
申请日期 |
2006.03.21 |
申请人 |
AGERE SYSTEMS INC. |
发明人 |
LIAN SEAN;RYAN VIVIAN;YENCHO DEBRA LOUISE |
分类号 |
H01L23/52;H01L21/607;H01L21/66 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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