发明名称 Through board inverted connector
摘要 A connector assembly is configured to be mounted to a substrate that has an opening extending between a mounting side and an opposite side. The connector assembly includes a housing and one or more contacts. The housing has a front end and a back end, with an interior chamber extending inward from a mating interface. The front end of the housing is configured to be partially inserted through the opening in the substrate until a housing mounting surface engages the mounting side of the substrate. The contact extends between a mating end and a contact mounting surface. The contact mounting surface is configured to be mounted to the mounting side of the substrate. The housing and contact mounting surfaces are substantially coplanar in a mourning plane, and a distance between the mating interface and the mounting plane is at least as great as a thickness of the substrate.
申请公布号 US7704082(B2) 申请公布日期 2010.04.27
申请号 US20080144241 申请日期 2008.06.23
申请人 TYCO ELECTRONICS CORPORATION 发明人 DAILY CHRISTOPHER G.;MOSTOLLER MATTHEW
分类号 H01R12/00 主分类号 H01R12/00
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