发明名称 On-chip heater and methods for fabrication thereof and use thereof
摘要 An on-chip heater and methods for fabrication thereof and use thereof provide that the heater is located within an isolation region that in turn is located within a semiconductor substrate. The heater has a thermal output capable or raising the semiconductor substrate to a temperature of at least about 200° C. The heater may be used for thermally annealing trapped charges within dielectric layers within the semiconductor structure.
申请公布号 US7704847(B2) 申请公布日期 2010.04.27
申请号 US20060419341 申请日期 2006.05.19
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CANNON ETHAN H.;STRONG ALVIN W.
分类号 H01L21/762 主分类号 H01L21/762
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