发明名称 |
On-chip heater and methods for fabrication thereof and use thereof |
摘要 |
An on-chip heater and methods for fabrication thereof and use thereof provide that the heater is located within an isolation region that in turn is located within a semiconductor substrate. The heater has a thermal output capable or raising the semiconductor substrate to a temperature of at least about 200° C. The heater may be used for thermally annealing trapped charges within dielectric layers within the semiconductor structure.
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申请公布号 |
US7704847(B2) |
申请公布日期 |
2010.04.27 |
申请号 |
US20060419341 |
申请日期 |
2006.05.19 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CANNON ETHAN H.;STRONG ALVIN W. |
分类号 |
H01L21/762 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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