发明名称 |
NON-SHIRINGKAGE CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>PURPOSE: A non-shrinkage ceramic substrate and a manufacturing method thereof are provided to reduce an electrode connection defect by filling a via electrode part and a void in a ceramic laminated body with a plating part. CONSTITUTION: A ceramic laminated body(100) is formed by laminating a plurality of green sheets. An internal electrode part(120) is formed inside the ceramic laminated body. A via electrode part(110) is formed by passing through the ceramic laminated body in order to be electrically connected to the internal electrode part. An external electrode part(130) is formed in the surface of the ceramic laminated body in order to be contiguous to the via electrode part. The external electrode part is electrically connected to the via electrode part. A plating part(150) is filled in a void formed in the interface between the via electrode part and the ceramic laminated body during the plasticity of the ceramic laminated body.</p> |
申请公布号 |
KR20100042788(A) |
申请公布日期 |
2010.04.27 |
申请号 |
KR20080101934 |
申请日期 |
2008.10.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, JIN WAUN;JEONG, SEUNG GYO |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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