| 摘要 |
A method of manufacturing a module, formed of a semiconductor element flip-chip bonded to a substrate and chip component soldered to the substrate, is disclosed. The method includes a step of mounting the chip component and the semiconductor element to the substrate, a first injection step for injecting first resin from a center of a lateral face of the semiconductor element into a gap between the semiconductor element and the substrate, a second injection step for applying second resin having a greater viscosity than the first resin to corners of the semiconductor element before the first resin reaches the corners, and a curing step for heating the module. This method allows mounting the chip component closer to the semiconductor element, so that the component can be mounted at a higher density on the module.
|
