发明名称 Method for fabricating semiconductor device having conductive liner for rad hard total dose immunity
摘要 The invention relates to a method includes etching at least one shallow trench in at least an SIO layer; forming a dielectric liner at an interface of the SIO layer and the SIO layer; forming a metal or metal alloy layer in the shallow trench on the dielectric liner; and filling the shallow trench with oxide material over the metal or metal alloy.
申请公布号 US7704854(B2) 申请公布日期 2010.04.27
申请号 US20080115690 申请日期 2008.05.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DENNARD ROBERT H.;HAKEY MARK C.;HORAK DAVID V.;MEHTA SANJAY
分类号 H01L21/76 主分类号 H01L21/76
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