发明名称 |
Method for fabricating semiconductor device having conductive liner for rad hard total dose immunity |
摘要 |
The invention relates to a method includes etching at least one shallow trench in at least an SIO layer; forming a dielectric liner at an interface of the SIO layer and the SIO layer; forming a metal or metal alloy layer in the shallow trench on the dielectric liner; and filling the shallow trench with oxide material over the metal or metal alloy.
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申请公布号 |
US7704854(B2) |
申请公布日期 |
2010.04.27 |
申请号 |
US20080115690 |
申请日期 |
2008.05.06 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DENNARD ROBERT H.;HAKEY MARK C.;HORAK DAVID V.;MEHTA SANJAY |
分类号 |
H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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