发明名称 |
Wafer position teaching method and teaching jig |
摘要 |
An object is to provide a method for teaching the position of a semiconductor wafer automatically and accurately without relying on the sight of an operator as well as a teaching jig that is used for the above method. To this end, in the invention, a teaching jig 11 is detected by a first transmission-type sensor 6 that is provided at the tips of a wafer gripping portion 5 of a robot. The teaching jig 11 is composed of a large disc portion 12 that is the same in outer diameter as a semiconductor wafer and a small disc portion 13 that is concentric with the large disc portion 12. The teaching jig 21 is detected by a second transmission-type sensor 18 that is provided on the wafer gripping portion 5. The second transmission-type sensor 18 is mounted on a sensor jig 15 so as to be detachable form the wafer gripping portion 5.
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申请公布号 |
US7706919(B2) |
申请公布日期 |
2010.04.27 |
申请号 |
US20040488694 |
申请日期 |
2004.10.05 |
申请人 |
KABUSHIKI KAISHA YASKAWA DENKI |
发明人 |
ADACHI MASARU;KAWABE MITSUNORI;SHIGESADA MASARU |
分类号 |
G05B19/04;B25J9/22;G05B19/18;H01L21/00;H01L21/68;H01L21/687 |
主分类号 |
G05B19/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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