发明名称 MOLD RELEASE AGENT COMPOSITION FOR THERMOCOMPRESSION MOLDING AND PROCESS FOR PRODUCING BOARD
摘要 A mold release agent composition, or adhesive, capable of permanent mold release of a board containing any of lignocelluloses and an inorganic material easily from a hot platen in thermocompression molding, excelling in not only mold release capability and productivity but also heat resistance realizing an extremely low possibility of thermal deterioration on the hot platen; and a process for producing therewith a board through thermocompression molding of a molding material containing any of lignocelluloses, which board excels in secondary processability, water absorption swell ratio and flexural modulus. The mold release agent compositionis characterized by containing (I) polyester compound produced through reaction of (A) polyhydric alcohol, (B) dibasic acid and (C) saturated fatty acid in a molar proportion such that (A):(B):(C) = 1 : 0.5 to 1 : 2 to 3 and (II) low-density polyethylene in a weight ratio such that (I):(II) = 1:4 to 4:1.
申请公布号 KR20100043090(A) 申请公布日期 2010.04.27
申请号 KR20107004531 申请日期 2007.08.31
申请人 MITSUI CHEMICALS, INC. 发明人 ITO TAKESHI;TAGUCHI ARATA;YAMAGATA MASARU;MATSUMOTO HIROSHI
分类号 C09K3/00;B29C33/62;C09J175/00;C10M173/02 主分类号 C09K3/00
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