| 摘要 |
PURPOSE: An electroless plating method for a chip assembly is provided to reduce the material waste by evaporating a gold plating metal layer on one side or both sides of a wafer at the same time. CONSTITUTION: An electroless plating method for a chip assembly comprises the following steps: dipping a wafer in the inside of an organic solvent tank containing an organic solvent(101); dipping the wafer into a water tank containing water(102); removing the water from the surface of the wafer(103); performing a surface modification plasma process to remove an organic residue(104); dipping the wafer to a precipitating tank(105); dipping the wafer into a chemical plating tank to form a metal layer around an opening(107); and removing the wafer from the surface of a chip assembly(108).
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