发明名称 |
PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: A printed circuit board and a method for manufacturing the same are provided to prevent the generation of deviation during an etching process by forming a circuit pattern using a seed layer. CONSTITUTION: A carrier including a seed layer is prepared(S110). A connection region layer is inserted between the seed layer and the electrode of electronic components in order to stack the electronic components on the seed layer(S120). The electronic components are embedded in an insulation layer(S130). The carrier is removed(S140). A circuit pattern, which is electrically connected to the electrode through the connection resin layer, is formed on the seed layer(S150). The exposed seed layer is etched(S160).</p> |
申请公布号 |
KR20100041980(A) |
申请公布日期 |
2010.04.23 |
申请号 |
KR20080101060 |
申请日期 |
2008.10.15 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, WOON CHUN;YI, SUNG;YIM, SOON GYU |
分类号 |
H05K1/18;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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