A METHOD OF CUTTING A SEMICONDUCTOR WAFER

摘要

PURPOSE: A method for cutting a semiconductor wafer is provided to improve brightness of an LED(Light Emitting Diode) chip by removing the contamination due to dust through a post-process. CONSTITUTION: A scribe line(360) is formed on one of the upper side or lower side of a wafer(310) by irradiating a laser beam. A scribe line is composed of a plurality of holes which are divided with a chip unit. The scribe line formed on one side of the wafer is etched to remove the dust when forming the plurality of holes. The wafer is cut along the scribe line.