| 摘要 |
<p>PURPOSE: A method for simultaneously cutting a compound rod of a semiconductor material into a multiplicity of wafers is provided to improve the deflection of a semiconductor which is manufactured in a complex rod while avoiding geometrical transformation. CONSTITUTION: More than two work cut pieces(11, 12) which are cut by more than one semiconductor rod are selected from a work piece stock. More than one of two ends is ground. A compound rod piece is manufactured at the ground end by fixing unit and is fixed on a mounting plate in longitudinal direction. A mounting plate in which the compound rod piece is fixed is cramped by a wire saw.</p> |
