| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding apparatus and a bonding method, which can achieve high connection reliability while reducing a bonding time in bonding a chip component in which bumps are formed. <P>SOLUTION: The bonding apparatus includes: a low temperature head 210 heated at a first temperature; a high temperature head 220 heated at a second temperature; a first heating and pressing means for bringing a chip 50 into contact with a circuit board 30 coated with an adhesive 20 and pressing the chip by the low temperature head; and a second heating and pressing means for switching from the low temperature head to the high temperature head while pressing by the first heating and pressing means is kept and pressing the chip by the high temperature head. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
