发明名称 METHOD OF CUTTING AND METHOD OF MANUFACTURING WORKPIECE
摘要 <p><P>PROBLEM TO BE SOLVED: To suppress stress on a workpiece when a protective sheet is removed from the workpiece. <P>SOLUTION: The contour of a grid-like region 12 of a TFT (Thin Film Transistor) side polarizing plate 7 is irradiated with a laser beam, the TFT side polarizing plate 7 at the end of the grid-like region 12 is pulled and thereby removed from a glass substrate 1. Consequently, the TFT side polarizing plate 7 can be peeled off from the glass substrate 1 without exerting a mechanical stress on the glass substrate 1, and therefore the stress on the glass substrate can be suppressed when the TFT side polarizing plate 7 is removed from the glass substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010089120(A) 申请公布日期 2010.04.22
申请号 JP20080261376 申请日期 2008.10.08
申请人 SEIKO EPSON CORP 发明人 YAMAZAKI YUTAKA;UMETSU KAZUNARI;TAKAHASHI SHINGO
分类号 B23K26/38;B23K26/00;B23K26/073;G02F1/13;G02F1/1333 主分类号 B23K26/38
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