| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable a high-yield and high-quality sealing without reducing the productivity of a resin sealing device by improving metering accuracy without reducing the metering speed on measuring a powdery resin. Ž<P>SOLUTION: A resin supply device 150 to feed a powdery resin 106 for resin sealing to a resin sealing device 100 which resin seals a substrate 102 arranged with a semiconductor chip 104; wherein the device is equipped with a resin conveyance way 156 in which the powdery resin 106 is put, conveyed to its head end part 156A to drop it from the head end part 156A, and a vibrator 160 to vibrate the resin conveyance way 156; and wherein the head end part 156A of resin conveyance way 156 is molded into the angle of repose θ of powdery resin 106 to horizontal direction. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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