| 摘要 |
<p>Provided is an electrostatic chuck, which can reduce the adhesion of contaminants from a substrate adsorption face to a substrate, to thereby perform cooling via the electrostatic chuck while keeping the substrate contact area optimum. In the electrostatic chuck, an elastic adsorption layer having a plurality of raised portions of an elastic material is made into the substrate adsorption face so that the substrate is adsorbed and held via the elastic adsorption layer. The raised portions on the elastic adsorption layer have a height h(m); the number of the raised portions per unit area on the substrate adsorption face is n(pieces/m2); the top faces of the raised portions have an area A(m2); and the elastic material forming the raised portions has a modulus of elasticity E(Pa). When the substrate having an overall flatness Wh(m) is adsorbed and held by an adsorption force F(Pa), the quantity d(m), in which the raised portions shrink in the acting direction of the adsorption force F, satisfies the following relation (1), and the ratio ? of the total area of the raised portion top faces per the unit area of the substrate adsorption face is 10 % or more: 5Wh = d = 0.5Wh, and d = (h/nA)·(F/E) - - - (1).</p> |
