| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing device which enables easy comprehending of the significance of a preset value and also, setting of optimal operation timing for reducing the generation of voids which worsen the yield, the distortion of wires which connect a semiconductor chip to a substrate, etc. in a resin sealing process including a decompression operation. Ž<P>SOLUTION: In the resin sealing device 100 which seals the resin through the decompression operation under the arrangement of the substrate 102 and the semiconductor chip 104 in molds 126A and 126B, the molds 126A and 126B each have a top force 128 and a bottom force 130 which moves back and forth to the top force 128. Further, the device 100 includes an operating display panel 154 which displays in itself, operating line graphs 156A and 156B of the bottom force 130 during resin sealing, and concurrently, actual result values relative to decompression operation to be obtained when the bottom force 130 is actuated from the preset value for specifying a decompression/compression process (a decompression/back and forth movement process) involving the back and forth movement operation and the decompression operation of the bottom force 130. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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