| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed electronic component that securely prevents a resin from leaking in an engagement portion between a case-side wall member and a case base or a through-hole into which a terminal for external connection is inserted, and to provide a method of manufacturing the resin-sealed electronic component. SOLUTION: The resin-sealed electronic component includes a resin injection groove portion 9 formed along the engagement portion 7 between the case-side wall member 2 and case base 3, a projection portion 14 arranged having a gap with the terminal 6 for external connection, and a resin reception portion 14a extended to below the terminal 6 for external connection along the through-hole 10, and fine gaps are blocked by making a gap closing resin 8 injected into the resin injection groove portion 9 infiltrate a gap of the engagement portion 7 through capillarity and also making a gap closing resin 8 passed through the gap between the resin reception portion 14a and terminal 6 for external connection infiltrate the gap between the through-hole 10 and terminal 6 through capillarity, thereby preventing the resin from leaking. COPYRIGHT: (C)2010,JPO&INPIT
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