发明名称 BONDING METHOD, BONDED STRUCTURE, METHOD FOR PRODUCING OPTICAL MODULE, AND OPTICAL MODULE
摘要 A light-permeable layer having a light-transmitting composition (21) as the parent material and a light-transmitting filler (22) having a refractive index different from the light-transmitting composition (21) is formed on the surface of a first light-blocking member (10), a liquid photocuring adhesive is applied to a surface (20a) of the light-permeable layer (20), a second light-blocking member (30) is disposed on the surface (20a) of the light-permeable layer (20) to which liquid  photocuring adhesive has been applied, this light-permeable layer (20) is exposed to light of a predetermined wavelength from the side of the light-permeable layer (20),  the liquid photocuring adhesive is cured, and the light-permeable layer (20) and second light-blocking member (30) are bonded in order to bond the first light-blocking member (10) and second light-blocking member (30).  As a result, when light-blocking members are bonded together using a photocuring adhesive, easy and quick bonding is possible while sufficient bonding strength is guaranteed.
申请公布号 WO2010044408(A1) 申请公布日期 2010.04.22
申请号 WO2009JP67757 申请日期 2009.10.14
申请人 OMRON CORPORATION;USHIRO, YUKI;KAMEDA, TAKAMASA;KOMAI, KAZUNORI;MIYATA, TSUYOSHI;OKUNO, MOTOHARU;KASUYA, MAKOTO 发明人 USHIRO, YUKI;KAMEDA, TAKAMASA;KOMAI, KAZUNORI;MIYATA, TSUYOSHI;OKUNO, MOTOHARU;KASUYA, MAKOTO
分类号 C09J5/00;B32B7/02;G02B6/122;G02B6/42;H01L23/29;H01L23/31;H01L31/02;H01L33/00 主分类号 C09J5/00
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