| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem occurring in a method of manufacturing a conventional wiring board in which a wiring board formed on a metal plate of a predetermined thickness is formed, and thereafter the metal plate is removed by etching. SOLUTION: By using an exposed metal foil 10b, a first conductor patterns 18 electrically connected to vias 24 connected to metal foil 10b of the other-side metal foil 10 with a carrier is formed, thereafter metal foil 10 with a carrier is arranged on the first conductor pattern 18 side through an insulating layer 12; next, vias 24 for electrically connecting the first conductor pattern 18 to the metal foil 10b are formed at predetermined parts of the exposed metal foil 10b by peeling off a carrier plate 10a of the metal foil 10 with a carrier on the first conductor pattern 18 side; and thereafter a carrier plate 10a of the other-side metal foil 10 with a carrier arranged to sandwich the first conductor pattern 18 is peeled off to form a board including the vias 24 penetrating insulating layers 12 formed on both surface sides of the first conductor pattern 18. COPYRIGHT: (C)2010,JPO&INPIT |
