| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a reverse mesa type crystal oscillating piece having an excellent mass productivity and high occupying ratio of an oscillating part. Ž<P>SOLUTION: The method for manufacturing the crystal oscillating piece 10 uses a wafer 30 including edges parallel with each of a Z" axis obtained by rotating a Z' axis within a range of +60° from -120° around a Y' axis while using a rotation in the +X-axis direction around the Y' axis of a +Z' axis in an AT-cut crystal plate as a positive angle of rotation and an X' axis vertically crossing with the Z" axis. The method for manufacturing the crystal oscillating piece 10 includes a first etching process wet etching the outer peripheries of a thin forming region 34 configuring an oscillating part 16 and a thick forming region adjacent to the thin forming region and the outer periphery of a thick non-forming region formed at the -Z"-axis side end of at least the thin forming region when carrying out a working from a main surface on the +Y'-axis side; and a second etching process penetrating the outer periphery of the thick forming region and the outer periphery of the thick non-forming region in the Y'-axis direction by a wet etching in this case. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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