| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing that achieves reduced warpage in BGA (Ball Grid Array) packaging, reduced difference in warpage with temperature change from room temperature to a reflow temperature, reduced defects in secondary packaging, and reduced defects, such as a void or gold wire flow because of good flowability thereof, and also good flame retardancy with non-halogen and non-antimony condition without degrading moldability, moisture resistance, and reliability such as high temperature-leaving characteristics; and to provide an electronic component device including an element sealed by the same. Ž<P>SOLUTION: The epoxy resin composition for sealing is provided containing (A) epoxy resin and (B) a curing agent. The epoxy resin (A) contains a compound represented by specific chemical formula, and the curing agent (B) contains a phenolic resin represented by specific chemical formula. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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