| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a heat-generating semiconductor element, the semiconductor device being superior in heat dissipation and highly reliable with simple constitution, and to provide a method of manufacturing a semiconductor which is superior in economical efficiency. <P>SOLUTION: The semiconductor element 3 and a control component 2 are mounted on wiring members 11, 110, 12, 120 made of metal, and the semiconductor element 3, control component 2 and a predetermined range of the wiring members 11, 110, 12, 120 are covered with a resin molding 7 to form an integrated package module 10. Parts 11 and 12 of the wiring members led out of the resin molding 7 are exposed from a bottom 220 of the housing 20 housing the package module 10, and used as connector terminals to be connected outside. <P>COPYRIGHT: (C)2010,JPO&INPIT |
