| 摘要 |
A semiconductor device, includes: an organic multilayer wiring substrate having an inner conductive layer; a semiconductor element mounted and connected on one surface of the wiring substrate; and a plurality of solder balls disposed on the other surface in a grid array. A defect portion is formed at an area corresponding to a corner solder ball disposed at an outer peripheral corner, or at an area corresponding to the corner solder ball and peripheral solder balls at the inner conductive layer. Temperature rises of the solder balls disposed in a vicinity of the corner are suppressed, and therefore, the semiconductor device of which fatigue life is prolonged and superior in reliability can be obtained.
|
