METHOD OF PRINTING SOLDER BUMPS ON SINGLE PRINTED CIRCUIT BOARD

摘要

<P>PROBLEM TO BE SOLVED: To provide a method of printing solder bumps on a single printed circuit board. Ž<P>SOLUTION: The present invention includes the steps of: providing the method of printing solder bumps on the single printed circuit board and providing a whole printed circuit board including completed internal circuits; dividing the whole printed circuit board into a plurality of independent single printed circuit boards; performing an electronic test on the single printed circuit boards; and forming a plurality of solder bumps on the single printed circuit boards. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž