发明名称 MOUNTING DEVICE FOR ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting device that can securely detect that the remaining amount of a sheet, used to primarily pressure-bond a TCP temporarily pressure-bonded to a substrate with a pressure bonding tool, decreases below a prescribed amount. Ž<P>SOLUTION: The mounting device includes the pressure bonding tool configured to pressure-bond a TCP to a substrate held by an XY table with a sheet 22 interposed, a cassette which has a take-up body to be wound with a sheet mounted on a pay-off shaft and provided such that a part positioned between the pay-off shaft and take-up body for the sheet is positioned between the substrate held by the XY table and the pressure bonding tool, a take-up motor for taking up the sheet by a prescribed length at each time by rotating the take-up body, and a detecting means 42 of detecting that the remaining amount of the sheet wound around the pay-off shaft decreases below the predetermined amount. Through-holes 41 are formed at end parts of the sheet wound around the pay-off shaft, and an optical detecting means includes a projector 43 and a photodetector 44 that optically detect the through-holes when the part of the sheet where the through-holes are formed is paid off from the pay-off shaft. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010093205(A) 申请公布日期 2010.04.22
申请号 JP20080264420 申请日期 2008.10.10
申请人 SHIBAURA MECHATRONICS CORP 发明人 MINAMIHAMA ETSURO
分类号 H01L21/60 主分类号 H01L21/60
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