| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device, which does not cause cracks and peeling-off in a bond material, which is a connection of a lid and a package base, by nipping a resin part, even when loading a package employing a glass lid. <P>SOLUTION: The method of manufacturing a piezoelectric oscillator 10 has a stage of forming the resin part 52 around a package 12. The method has a step of arranging a plurality of packages 12 in a frame to pour the resin, and covering the plurality of packages 12 with the resin, a step of scraping the resin that adheres to the upper face of the lid 16 of the plurality of packages 12, and a part of the resin poured between the lids 16 of the adjacent packages 12, by a squeegee, and a step of singulating the piezoelectric oscillator 10 per each package 12, after the resin is cured. <P>COPYRIGHT: (C)2010,JPO&INPIT |
