发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board having a plurality of wiring layers, wherein it is possible to adjust an electric characteristic of wiring without increasing a resistance value and an inductance value. SOLUTION: The wiring board including the plurality of wiring layers includes: first wiring 1a formed in a first wiring layer 61 of the plurality of wiring layers; second wiring 1b formed in a second wiring layer 62 of the plurality of wiring layers; and a via 5 which is a connection member made of a conductor. The via 5 is composed of a first via 5a and a second via 5b for connecting the first wiring 1a with the second wiring 1b. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010093018(A) 申请公布日期 2010.04.22
申请号 JP20080260552 申请日期 2008.10.07
申请人 PANASONIC CORP 发明人 YAMAGUCHI HIROSHI
分类号 H01L23/12;H05K1/02;H05K3/46 主分类号 H01L23/12
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