| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe assembly which facilitates simultaneous inspection of a plurality of chips of LSIs having narrow pitches and multiple pins. SOLUTION: The probe assembly is employed for performing circuit inspection of semiconductor chips by using a resin film bonded with metallic foil, etching the metallic foil and forming on the resin film a conductive part comprising a probe, laminating a plurality of such resin films provided with probes, and bringing tips of the probes into contact with the electrode pads of the semiconductor chips collectively. In the probe assembly, the plurality of resin films with the probes are laminated, each of which has a plurality of probe structure sections comprising spring deformation sections and arranged on one resin film with a probe at positions where mutual interference does not occur, in the x direction (direction of pad arrangement) and in the z direction (direction perpendicular to the semiconductor chip surfaces) inside the resin film surface. COPYRIGHT: (C)2010,JPO&INPIT
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