发明名称 |
Anriebbeständige gesinterte Cu-Ni-Sn-Legierung auf Kupferbasis und hieraus hergestelltes (Kugel-)Lager |
摘要 |
<p>A Cu-Ni-Sn copper-based sintered alloy has a composition including 10 to 40% by mass of Ni, 5 to 25% by mass of Si, and the remainder containing Cu and inevitable impurities, and if necessary, 0.1 to 0.9% by mass of P, 1 to 10% by mass of C, 0.3 to 6% by mass of calcium fluoride or 0.3 to 6% by mass of molybdenum disulfide. In the structure of the alloy, a phase of a composition containing Cu(4-x-y)NixSny (where x: 1.7 to 2.3, y: 0.2 to 1.3) is dispersed.</p> |
申请公布号 |
DE112007001514(T5) |
申请公布日期 |
2010.04.22 |
申请号 |
DE20071101514T |
申请日期 |
2007.06.27 |
申请人 |
MITSUBISHI MATERIALS PMG CORPORATION |
发明人 |
HARAKAWA, TOSHIRO;SHIMIZU, TERUO;MARUYAMA, TSUNEO |
分类号 |
C22C9/06;B22F5/00;C22C1/05;C22C9/02;F16C33/10;F16C33/12 |
主分类号 |
C22C9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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