| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing a semiconductor device which suppress the reduction of yielding in the semiconductor device. <P>SOLUTION: The method for manufacturing the semiconductor device includes: a process for forming a support substrate 11 and a resin layer 13 on the support substrate 11, which is made of a thermoplastic resin, and forming an intermediate structure body 20 having a wiring substrate 21, a semiconductor chip, and a seal resin 27 on the resin layer; a process for fixing the support substrate to a lower fixing heating unit 33 and fixing the intermediate structure body to an upper fixing heating unit 43; a process for performing heating with the use of the lower and upper fixing heating units, so as to soften the resin layer; a process for moving the upper fixing heating unit, by keeping a horizontal state, with respect to the lower fixing heating unit, thereby making a segment, subsequently making another segment by changing directions, and having a plurality of segments where a distance between a center of the support substrate and a center of the intermediate structure body at the end point becomes larger than a distance at the start point; and a process for repeating the movement along the segments until the support substrate and the intermediate structure body are separated by the resin layer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
