| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive solder alloy which has low Ag content and whose soldering property is enhanced. SOLUTION: The solder alloy has a composition composed of, by weight, 0.1-0.4% Ag, 0.5-3.0% Cu, 0.5-1.0% In and the balance Sn with inevitable impurities. The soldering property can be considerably enhanced by simultaneously adding Cu and In of the predetermined concentration to Sn which is the main component of the lead-free solder alloy while minimizing the addition of expensive Ag. COPYRIGHT: (C)2010,JPO&INPIT
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