| 摘要 |
The present invention relates to an LED assembly having a redundancy electrode and a fabrication method thereof. The LED assembly having a redundancy electrode according to the present invention, comprises a conductive substrate for LED, a first clad layer formed on the substrate, an active area formed on the first clad layer, a second clad layer formed on the active area, a junction layer formed on the second clad layer, a first electrode formed on the second clad layer or on the junction layer, a second electrode formed beneath the substrate, a redundancy electrode formed in the partially exposed area of one of the substrate and the first clad layer, a first lead wire-bonded to the first electrode, and a second lead bonded to the second electrode by a conductive adhesive, and wire-bonded to the redundancy electrode. |
