| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that enables the inspection of breakages or cracks, etc., from the outer periphery of a semiconductor chip, and also the inspection of a defectiveness in coupling between the back electrode of the semiconductor chip and a package bottom terminal. <P>SOLUTION: The semiconductor device 1 is formed as follows. The semiconductor chip 2 is formed with a molded package. The package bottom terminal 30 and package terminals are arranged. A defect detection conductor body 3, a start point bonding pad 11 connected to one end of the defect detection conductor body 3, and an end point bonding pad 12 connected to the other end are formed on the surface of the semiconductor chip 2. A serial circuit is formed between the terminal 31 for an inspection being one of the package terminals of the semiconductor device 1 and the package bottom terminal 30, where the start point bonding pad 11, the defect detection conductor body 3, the end point bonding pad 12, a penetration conductor body 4, and the back electrode 6 are serially connected by starting from the terminal 31 for the inspection and ending at the package bottom terminal 30. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
